Deep Etching - K2M Ingenieurbuero

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Deep Etching


During deep etching of Sn-based leadfree solder alloys: the Sn-matrix is dissolved while most of the intermetallic compounds are remaining.

Near-eutectic SnAgCu-alloy

The Sn-matrix has been dissolved, while the rod-shaped intermetiallic compounds of the eutectic microstructure remain.


Micro-alloyed leadfree solder material

The nuclei of the primary Ag3Sn-phase reveal their typical shape.


Primary phases of a leadfree solder joint

Primary (pre-eutectic) Cu6Sn5-phases solidified in hexagonal shape, larger crystals are often hollow.

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