Elektronics
Gallery
![](images/BGA_-.jpg)
![](images/BGA_links.jpg)
![](images/BGA_mitte.jpg)
![](images/BGA_rechts.jpg)
X-section of a defective electronic BGA-component: Disruption of the die-attach material between silicon chip and interposer
![](images/Lackschicht.jpg)
Incomplete protective coating on an electronic device
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On-target preparation of a wire-bond interconnect